Method for supplying solder to minute soldering land

微小はんだ付けランドへのはんだ供給方法

Abstract

PROBLEM TO BE SOLVED: To supply a minute amount of solder to a minute soldering land formed on a substrate having large unevenness. SOLUTION: In a method for supplying a solder to a minute soldering land 12 on a surface of a substrate 2 on which for a micro electronic component 14 to be mounted when the micro electronic component 14 is mounted on the substrate 2, a long and narrow wedge tool 10 is placed almost right above the minute soldering land 12, and a solder wire 7 extending to the undersurface of the wedge tool 10 is pushed and joined onto the soldering land 12 by the wedge tool 10, for the solder to be supplied. COPYRIGHT: (C)2008,JPO&INPIT
【課題】凹凸の大きい基板に設けられた微小のはんだ付けランドに対して、微量のはんだを安定して且つ確実に供給する。 【解決手段】微細電子部品14を基板2に装着する際に、微細電子部品14を装着すべき基板2表面の微小はんだ付けランド12にはんだを供給する方法であって、微小はんだ付けランド12の略直上に細長状のウェッジツール10を配置して、ウェッジツール10の下面に延在したはんだ線7をウェッジツール10ではんだ付けランド12に押圧して接合してはんだ供給する。 【選択図】図3

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Patent Citations (4)

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